South Korea's Doosan Corp. completed the construction of a high-end copper foil plant to produce materials widely used in automotive electronic components and 5G (fifth-generation) communication equipment.
Doosan said on Thursday that it held a ceremony to commemorate the completion of its high-end flexible copper-clad laminate (FCCL) plant at the Horizon Industrial Complex in Gimje, North Jeolla Province.
The new plant covers 13,000 square meters of the 82,211-square-meter site.
FCCL is a thin and flexible copper-clad laminate that can bend and fold, serving as a core material in flexible printed circuit boards (FPCBs) used in electronic products like smartphones and tablet PCs, as well as 5G communication equipment.
As advanced device designs become more diverse with foldable or curved forms, the importance of FCCL has increased.
The Gimje plant will produce casting-type FCCL. FCCL is broadly divided into lamination and casting methods based on manufacturing.
Casting-type FCCL is produced by repeatedly coating and drying polyimide (PI) resin onto copper foil.
Doosan plans to gradually expand FCCL production at the Gimje plant to meet market demand.
Write to Woo-Sub Kim at
duter@hankyung.com
