Hanmi Semiconductor Co., South Korea’s leading chip packaging equipment manufacturer, held a ground-breaking ceremony for its seventh plant of the TC Bonder for high-bandwidth memory (HBM) manufacturing in Incheon on Monday.
The new facility will be a two-story, 14,400 square-meter building with a gross floor area and is expected to be completed in the fourth quarter of this year.
The company plans to produce new equipment at the new plant, including 2.5D Big Die TC bonders, fluxless bonders for sixth-generation HBM production, and hybrid bonders.
TC bonder is a device that connects stacked DRAMs by applying heat and pressure.
Hanmi Semiconductor is No. 1 in global TC bonder market. The firm supplies 90% of HBM3E 12-stage products, including SK Hynix, Micron, Nvidia, and Broadcom.
After the new plant is completed, Hanmi Semiconductor will have 89,530 square meters of HBM TC bonder production facilities.
This is enough to achieve 2 trillion won in annual sales.
Write to Jeong-Soo Hwang at hjs@hankyung.com
Hanmi Semiconductor's TC bonder (Courtesy of Hanmi Semiconductor) Hanmi Semiconductor Co., South Korea’s leading chip packaging equipment manufacturer, has revised upwards its annual sales target for this year to 650 billion won ($471 million) to meet the growing demand for its machines a