Hanmi Semiconductor wins $110 mn HBM equipment order from SK Hynix

The company's dual TC bonder Griffin supply contract amounts to 94.3% of last year's consolidated sales revenue

Hanmi Semiconductor wins 0 mn HBM equipment order from SK Hynix
Jeong-Soo Hwang 1
2024-06-07 17:35:25 hjs@hankyung.com
Korean chipmakers

South Korean chip equipment company Hanmi Semiconductor Co. announced on Friday that it has received an order from SK Hynix Inc. for its dual TC bonder Griffin equipment used in high-bandwidth memory (HBM) manufacturing.

The contract amount is 149.9 billion won ($109.5 million). This is 94.28% of last year's consolidated sales of 159 billion won.

The dual TC bonder Griffin is equipment for attaching and stacking semiconductor chips made with through-silicon via (TSV) technology onto a wafer.

Previously, Hanmi Semiconductor received orders worth more than 200 billion won for this equipment from SK Hynix.

With the latest supply contract, the cumulative order value has reached 358.7 billion won.

Write to Jeong-Soo Hwang at hjs@hankyung.com
#Hanmi Semiconductor #SK Hynix #dual TC bonder Griffin #HBM #TSV

Hanmi Semiconductor wins $16 mn HBM equipment order from SK Hynix

Hanmi Semiconductor wins $16 mn HBM equipment order from SK Hynix

South Korean chip equipment company Hanmi Semiconductor Co. announced on Friday that it has secured a 21.5 billion won ($16.1 million) supply deal for its third-generation artificial intelligence (AI) semiconductor high-bandwidth memory (HBM) hypermodel "dual TC bonded griffin" with SK Hynix I

Hanmi Semiconductor wins $31 mn order HBM equipment for SK Hynix

Hanmi Semiconductor wins $31 mn order HBM equipment for SK Hynix

South Korean chip equipment company Hanmi Semiconductor Co. said on Friday that it has secured a 41.5 billion won ($31.4 million) deal with SK Hynix Inc., the world’s second-largest memory chipmaker. The order, the largest in Hanmi's history, is for the second-generation "DUAL TC BONDER

Hanmi Semiconductor opens new bonder factory

Hanmi Semiconductor opens new bonder factory

South Korean chip equipment company Hanmi Semiconductor Co. said on Wednesday it has opened a new factory to boost the production of dual TC bonders, essential process equipment for the production of high bandwidth memory (HBM) used in artificial intelligence (AI) semiconductors.HBM is touted

Hanmi Semiconductor named world’s top 10 chip equipment maker

Hanmi Semiconductor named world’s top 10 chip equipment maker

South Korean chip equipment maker Hanmi Semiconductor Co. on Thursday said it made the world’s top 10 in the rankings of TechInsights, a global semiconductor research and analysis company. The list was based a a survey of semiconductor equipment clients worldwide. Hanmi was also named t

Korea's Hanmi Semiconductor releases new glass micro saw

Korea's Hanmi Semiconductor releases new glass micro saw

Hanmi Semiconductor's newly launched GL2101 micro saw (Courtesy of Hanmi Semiconductor) Hanmi Semiconductor Co., South Korea’s leading chip equipment maker, has launched a ‘full automation glass micro saw' dubbed GL2101 and began sales of the product to global clients, the Kospi-lis
(* comment hide *}